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Focus on investment and development layout of semiconductor wet process equipment industry

Fully realize the domestic substitution of semiconductor wet process equipment

SPIN COMPOSITE MACHINE (SC SERIES)

Applications

Panel level packaging

Warpage

≤±7mm

Panel size

515*510mm，Square panels in various sizes

Application of Wet Cleaning Processes

PI film developing
PR film developing
Copper etching
Titanium etching

Features&configurations

1-4 chambers（Supporting customization）
2-4 FOUP（Supporting customization）
Chemicals(Ex):Cyclopentanone，PGMEA，TMAH，NaCO3，DICO2，Ti Etching solution，Cu Etching solution，H2SO4 and other back spray configurations are available for selection
Supporting chemical CCSS，LCSS
Heating control, concentration control, flow rate control, pressure control et al.
Separated exhaust for acid, base and organics
Chemical reclaim
Bath overheating protection，leakage detection, classified discharge
SECS/GEM communication

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