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Focus on investment and development layout of semiconductor wet process equipment industry

Fully realize the domestic substitution of semiconductor wet process equipment

ZSE VACUUN FLUX CLRANER（SC SERIES）

Applications

Flux cleaning in 2.5D and 3D packages

Wafer size

200~300mm
Support warping operation
Can be compatible with warping degree ±5MM.

Process specifications

Particle removal
Flux cleaningl

Features & configurations

4 chambers
2 FOUP
Vacuum ≤10 torr
Support continuous vacuum operation, vacuum holding time ≥3H
Chemicals(Ex):DHF,SC1,SC2,DIO3,DICO2,IPA
Heating control,concentration control,flow rate control,pressure control et al.
Bath overheating protection，leakage detection, classified discharge
SECS/GEM communication

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